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I am looking for a macro that can take one or more dies and lay them out on wafer taking into account the wafer exclusion zone. Is there any such macro available ?
I've never seen, but never looked for one.
A lot of my work ends up on "pizza masks" where multiple dice
of different content share a reticle. So I will make the reticle
arrangement first. Then there aren't that many steps to fill the
size of wafers I generally work on. Set the snap spacing to the
reticle stepping distances and it takes maybe 5 minutes to fill
the circle and delete anything that's "hanging out".
Now, you get to sub-mm die size and 300mm wafers, maybe
this gets tedious. But maybe the workflow above has some
clues that could be "semi-automated" (like maybe only step /
place the reticle from a "done reticle layout").
Bear in mind that the stepping you pick, and what the foundry
may impose for maunfacturing structures, may differ and they
tend to want to do the reticle assembly themselves, with only
a "saw plan" from you. If there's an actual 1:1 engagement here
and not just going through motions.
Here's an pcell example of placing rects on the wafer. By converting the pcell in to flat cell and using "search & relpace" function in "edit" menu you can turn those rects into desired cell instances.
example script (python):
You can also use the Fill tool (Edit > Uitilities > Fill Tool). It places instances directly...
Here is a macro :
This is the same method as my Android app : Wafer gross die yield and cost
But with KLayout, you get the wafermap in GDS format as a result
From that result, you can generate the wafermap from your chip layout ...